SynWire – Winding Wires SynWire type 155, Copper Wire, round, enamelled, self bonding
- enamelled round copper wire, self-bonding
- insulated with solderable polyurethane
- aliphatic polyamide
- class 155
The SynWire type 155 is a thermal class F enamelled copper wire which can be directly soldered and self bonded under heat. With a solder bath temperature from 390 °C the wire is solderable without prior removal of the insulation film.
The SynWire type 155 is a 2-ply self bonding wire with a high resoftening temperature which is used to produce thermally stimulated windings in an integral and thus space saving, machine suitable, efficient and cost-effective manner. In contrast to impregnants, these windings can be bonded quickly and environmentally friendly. The self bonding windings are characterised by their thermal and mechanical stability. State-of-the-art processing techniques, process controls and checks ensure the constant high quality of these wires.
Application
Electric motors, induction coils, stator windings, air coils
Standards
IEC / DIN EN 60317-35
NEMA MW 131-C
Partly UL approved
Delivery forms
Grade 1B + 2B: 0.036 – 1.25 mm
You have questions according to our winding wires or want to send an inquiry?
Our product manager will be happy to help you.
![](/fileadmin/_processed_/f/3/csm_Dimitri_Jung_090124_Strator0333_badb2cc341.jpg)
Dr. Dimitri Jung
Product Manager enamelled copper wire round
+49 5235-968-235 wires@synflex.de
![Daniel Hochstädt](/fileadmin/_processed_/c/3/csm_SH-Wire_0025_1__a55c06d64c.jpg)
Product Manager enamelled copper wire flat
+49 5235-968-239 wires@synflex.de
Technical data
Typical properties of enamelled round self-bonding copper wire, 0.500 mm, with insulation film grade 1B
Property | Unit of measure | Set value | Actual value |
---|---|---|---|
Outer diameter with varnish | mm | min. 0.541 - max. 0.568 | as set value |
Bare wire diameter | mm | 0.495-0.505 | as set value |
Adhesion and elongation | 1 x d, no cracks | 1 x d / 10 % pre-elongation | |
Elongation at break | % | ≥ 28 | ≥ 28 |
Adhesiveness at r.t. | N | 1.1 | > 1.1 |
Property | Unit of measure | Set value | Actual value |
---|---|---|---|
Temperature index TI | °C | min. 155 | > 155 |
Re-softening temperature | °C | 160 | ≥ 160 |
Heat shock at 175 °C | ≥175 | ≥ 175 | |
Solderability at 390 °C | s | ≤ 6 | ≤ 4 |
Bonding temperature | °C | 200 ± 2 | 180-200 |
Cut through temperature (pre-heated block) | °C | min. 200 | ≥ 2 Min. at 200 |
Property | Unit of measure | Set value | Actual value |
---|---|---|---|
Dielectric strength RT | kV | ≥ 2.4 (Twist) | ≥ 2.4 (Twist) |
Electric conductivity | m/Ωmm² | 58 - 59 | 58.5 |