Winding wire SHBond^® WD210 Glide

• Enamelled round copper wire, thermoresistant,
  selfbonding and self lubricating
• Insulated with THEIC mod. polyesterimide
• plus polyamide-imide overcoat plus bonding layer
• Class 200

SHBond^® WD210 Glide is a highly thermoresistant self-bonding enamelled copper wire of heat performance class N. With this wire the excellent resistance and insulation properties of SHTherm^® 210 – Dualcoat are combined with the special application possibilities of an additional bonding layer which is based on mod. aromat. polyamide and which enables the production of heat bonded wire windings. Using this type of thermo-setting wire the heat bonding process is economic, as it can be executed within seconds and can support automatic processing. It is not harmful to the environment. Heat bonded windings show excellent thermal and mechanical stability and high resistance to climatic demands and many chemical agents. Sophisticated process technology and process setting ensure easy mouldability, good elongation and excellent insulation properties.

The final layer of varnish serves the purpose of providing a superior gliding surface, giving the wire excellent windability features at higher speeds, and enabling a higher filling factor plus reduced soiling of the winding machines. The reduced coefficient of friction helps to avoid damage to the wire during winding and thus maintains the insualtion properties of the wire.